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5.0mmt Electrically Isolating Cpu Thermal Pad For Telecommunication Hardware

5.0mmt Electrically Isolating Cpu Thermal Pad For Telecommunication Hardware

  • 5.0mmt Electrically Isolating Cpu Thermal Pad For Telecommunication Hardware
  • 5.0mmt Electrically Isolating Cpu Thermal Pad For Telecommunication Hardware
5.0mmt Electrically Isolating Cpu Thermal Pad For Telecommunication Hardware
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1200-30-05US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Certifications: IECQ QC 080000 Name: 5.0mmT Electrically Isolating CPU Thermal Pad For Telecommunication Hardware
Dielectric Constant: 4.0 MHz Application: SMD LED Module
Hardness: 18 Shore 00 Keyword: Thermal Gap Pad
High Light:

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Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


TIF100-30-05US-Series-Datasheet.pdf

 
TIF1200-30-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

 
<Good thermal conductive:3.0W/mK
<Thickness:5.0mmT
<Hardness:18 Shore 00
<Colour: blue

<Soft and compressible for low stress applications

<Naturally tacky needing no further adhesive coating

<Available in varies thicknesses

 
Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

 

 
Typical Properties of TIF1200-30-05US
 
Product Name 

TIF1200-30-05US Series

Colour
blue
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

5.0mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

1.0*1012 Ohm-cm

 
 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

5.0mmt Electrically Isolating Cpu Thermal Pad For Telecommunication Hardware 0
 

 
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

5.0mmt Electrically Isolating Cpu Thermal Pad For Telecommunication Hardware 1
 
FAQ

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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