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4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

  • 4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules
  • 4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules
4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1180-30-06UF thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Keyword: Thermal Gap Pad Specific Gravity: 3.0 G/cc
Material: Silicone Volume Resistivity: 2.3*1013 Ohm-cm
Certification: ISO9001 Name: 5.0 MHz Moldability For Complex Parts Heat Sink Pad For Memory Modules
High Light:

4.5mm silicone thermal heatsink insulator pads

,

5.0 mhz silicone thermal heatsink insulator pads

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memory modules heat sink pad

5.0 MHz Moldability for Complex Parts Heat Sink Pad for Memory Modules

 

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

TIF100-30-06UF-Series-Datasheet-.pdf

 

Ziitek TIF1180-30-06UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

 


 

<Good thermal conductive:3.0 W/mK
<Thickness: 4.5mmT
<Hardness:75±5 Shore 00
<Colour: White

<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available

 

 

 

 

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

 

 
Typical Properties of TIF1180-30-06UF
 
Product Name 

TIF1180-30-06UF Series

Colour
White
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

4.5mmT
Hardness
75±5 Shore 00
Dielectric constant@1MHz
5.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

2.3*1013 Ohm-cm

 
 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules 0
 

 
 
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules 1
 
FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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