| Place of Origin: | China |
| Brand Name: | Ziitek |
| Certification: | UL |
| Model Number: | TIF1100-20-10UF thermal pad |
| Document: | TIF100-20-10UF_Data Sheet.pdf |
| Minimum Order Quantity: | 1000 pcs |
|---|---|
| Price: | 0.1-10 USD/PCS |
| Packaging Details: | 24*13*12cm carton |
| Delivery Time: | 3-8 work days |
| Payment Terms: | T/T |
| Supply Ability: | 100000pcs/month |
| Products Name: | 2.5mm Thickness Electrically Isolating Thermal Pad Silicone Material For Waterproof LED Power | Recommended Operating Temperature: | -40 To 200℃ |
|---|---|---|---|
| Feature: | High Durability | Thickness: | 2.5mmT |
| Keyword: | Thermal Pad | Compostion: | Ceramic Filled Silicone Elastomer |
| Sample: | Free | ||
| Highlight: | LED Power Silicone Heat Sink Pad,Electrically Isolating Silicone Heat Sink Pad,2.5mmT Thermal Pad For Heat Sink |
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The TIF®1100-20-10UF Series is a structurally supportive thermal pad designed to deliver reliable heat dissipation while ensuring mechanical support and long-term durability. It reliably fills interface gaps, transfers heat, and provides mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications requiring a balance between heat dissipation, electrical insulation, and mechanical stability.
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 2.8 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.200 / 0.25~5.00 | ASTM D374 |
| Hardness (Shore OO) | 75 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 2.0 | ASTM D5470 |
| Thermal Conductivity (W/m-K) | 2.0 | ISO 22007 |
Ziitek, founded in 2006, is a high-tech enterprise focusing on independent research and development, production, and sales. The company is committed to providing customers around the world with products and overall solutions for heat conduction, heating, sealing, and EMI shielding.
Headquartered in Dongguan, Guangdong Province, Ziitek operates production bases in Kunshan (Jiangsu Province), Taiwan Province, and Vietnam. This global production capacity layout ensures rapid response and efficient delivery.
With an R&D team composed of senior engineers, Ziitek is driven by independent innovation and continues to develop cutting-edge products that meet the needs of new energy vehicles, energy storage systems, AI servers, 5G communications, aerospace, and other fields — with the goal of becoming a trusted strategic partner of customers.
Even though our products have passed strict inspection, if you find that parts cannot work well, please show us the proof. We will help you deal with it and provide a satisfactory solution.
A: Yes, we are willing to offer free samples.
A: We are a manufacturer in China and Vietnam.
A: Generally it is 3–7 working days if the goods are in stock, or 7–10 working days if the goods are not in stock. It depends on the quantity.
A: Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases, and phase-change materials.
A: Thermal conductivity measures a material’s ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression, and contact area.
A: Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
A: Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area, and interface conditions.
Contact Person: Dana Dai
Tel: +86 18153789196
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