High Thermal Conductive Liquid Metal Thermal Paste For CPU GPU Cooling PC AMD Intel Processor

High Thermal Conductive Liquid Metal Thermal Paste For CPU GPU Cooling PC AMD Intel Processor

TIG^®7835L liquid metal achieves liquid state and low surface tension characteristics at room temperature through new material technology and alloying process (different from ordinary metals that need to be heated to melting point for liquefaction). It has high fluidity and excellent thermal conductivity, and is not easy to evaporate, leak, safe and non-toxic, with stable physical and chemical properties.As the underlying technology in the field of heat dissipation,it can provide comprehensive and efficient solutions for high-power heat dissipation needs, adapt to the trend of future chip integration improvement, and ensure long-term stable operation of heat dissipation systems.

Features

> Excellent thermal conductivity
> Non toxic, environmentally friendly. and safe, meeting RoHS requirements
> Excellent long-term stability
> Thoroughly fill the contact surface to create low thermal resistance
> Not easily volatile

Applications

> Microprocessor
> Al chip
> Graphics processing chip
> Set top box
> LED TV and LED lighting fixtures
> Notebook
> Liquid cooled heat dissipation

Packaing:
TIG^®7835L is available in 1ml ,30ml,50ml syringes.

Storage Conditions:
After opening, please seal and store in an environment with a temperature below 30°C and humidity below 65%.
It is recommended to use within a week.

Usage Instructions:
This material causes corrosion to aluminum and should be avoided from direct contact.
After applying this material, it is recommended to use a suitable sponge or gasket to contain it along the edges of the liquid metal, ensuring that the material does not spread or disperse.
For more information about thermal conductive materials, please contact our company.