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3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized

3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized

3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized
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3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF300 Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: 3.0W High Quality Factory Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS Thinkness Range: 0.020"(0.50mm)~0.200"(5.00mm)
Keywords: Silicone Thermal Pad Hardness: 27±5 Shore 00
Thermal Conductivity: 3.0W/mK Color: Gray
Flam Rating: 94 V-0 Density: 3.05g/cm³
Application: LED CPU GPU MOS
Highlight:

3.0W Thermal Gap Filler Insulation Sheet

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CPU Thermal Gap Filler Insulation Sheet

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GPU Thermal Gap Filler Insulation Sheet

3.0W High Quality Factory Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

  

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

TIFTM300 Series thermally conductive interface materials are applied to fill theair gaps between the heating elements and the heat dissipation fins or the metalbase.Their flexibility and elasticity make them suited to coat very unevensurfaces.Heat can transmit to the metal housing or dissipation plate from theheating elements or even the entire PCB, which effecitly enhances the efficiencyand life-time of the heat-generating electronic components.

 

Features:
> Excellent thermal conductivity 3.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

Typical Properties of  TIFTM300 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.05g/cc ASTM D297
thickness 0.020"(0.50mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 27±5 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 4.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 3.0W/m-K ASTM D5470

 

Product Specification
Product Thicknesses: 0.02"(0.50mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
 
Additional model code instructions:
FG: Fiberglass reinforcement
A1/A2: Singleldouble sided with Adhesive
 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample. 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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