Name: Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF500-40-11U Series
Price: 4.10 USD
Availability: InStock

Home Products Heat Sink Thermal Pad

Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF500-40-11U Series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contact Now

Detailed Product Description

Products Name:	Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers	Dielectric Constant@1MHz:	7.0
Application:	AI Servers	Thermal Conductivity:	4.0W/m-K
Sample:	Sample Free	Dielectric Breakdown Voltage:	>5500 VAC
Keywords:	Silicone Thermal Pads	Fire Rating:	94 V0
Color:	Dark Gray	Thickness Range:	0.010inch~0.20inch/(0.25mm~5.0mm)

Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek TIF^®500-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit , It issuitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

> Good thermal conductive: 4.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Easy release construction

> Good insulation performance
> Electrically isolating
> High durability

Applications

> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

Typical Properties of TIF^®500-40-11U Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.2		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	27 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	4.0 W/m-K		ASTM D5470
	4.0 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Silicone Thermal Pad Offering Anti-Oxidation High Insulation & Quick Heat Dissipation For AI Servers 1

Tag:

thermal interface material pad,

thermal heat transfer pads,

thermal laptop cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer

product name: Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer

Materials: Ceramic filled silicone elastomer / Fiberglass

Feature: Soft and Compressible for low stress applications

Thermal conductivity: 3.0 W/mK

Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Product name: Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Materials: Ceramic filled silicone elastomer

Feature: Ultra soft

Thermal conductivity: 3.0W/mK

LTD Thermal Pad 5.0W Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU

Products name: LTD Thermal Pad 5.0W Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU

Thickness range: 0.04inch~0.20inch/(1.0mm)~5.0mm)

Thermal conductivity: 5.0W/m-K

Sample: Sample free

Multiple Thickness Factory Thermal Gap Filler Pad Thermally Conductive Silicone Pad For Electric Products

Products name: Multiple Thickness Factory Thermal Gap Filler Pad Thermally Conductive Silicone Pad For Electric Products

Thickness range: 0.020"~0.200"(0.5mm~5.0mm)

Sample: Sample free

Fire rating: 94 V0

RoHS Compliant 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For New Energy Vehicle

Products name: RoHS Compliant 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For New Energy Vehicle

Keywords: Thermal Pad

Sample: Sample free

Fire rating: 94 V0

1.5mm To 5.0mm Thick 1.5W Ultra Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

Products name: 1.5mm To 5.0mm Thick 1.5W Ultra Soft Silicone Pad For CPU GPU Semiconductor Heat Dissipation Thermal Pad

Sample: Sample free

Fire rating: 94 V0

Thermal conductivity: 1.5W/m-K

Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle

Products name: Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle

Sample: Sample free

Dielectric Constant: 4.5MHz

Dielectric Breakdown Voltage: >5500 VAC