Name: Gray 2.0W Thermal Insulation Silicone Soft Pad Thermal Gap Pad For Heat-Sink GPU Laptop Cooling
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF540-20-11U
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

Gray 2.0W Thermal Insulation Silicone Soft Pad Thermal Gap Pad For Heat-Sink GPU Laptop Cooling

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF540-20-11U

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	Gray 2.0W Thermal Insulation Silicone Soft Pad Thermal Gap Pad For Heat-Sink GPU Laptop Cooling	Thickness:	0.25~5.0mmT
Density:	2.5g/cm³	Dielectric Breakdown Voltage:	≥5500 VAC
Thermal Conductivity:	2.0W/m-K	Color:	Dark Gray
Operating Temp:	-40~200℃	Keywords:	Thermal Gap Pad
Highlight:	2.0W Silicone Soft Pad , Gray Silicone Soft Pad , Heat-Sink Silicone Soft Pad

Gray 2.0W Thermal Insulation Silicone Soft Pad Thermal Gap Pad For Heat-Sink GPU Laptop Cooling

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Product introduction

TIF^®500-20-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Features

> Good thermal conductive: 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

Applications

> Cooling components to the chassis of frame
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TIF^®500-20-11U Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.5		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.0)
Hardness	65 Shore 00	27 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL94 (E331100)
Thermal conductivity	2.0 W/m-K		ASTM D5470
	2.0 W/m-K		ISO22007

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Gray 2.0W Thermal Insulation Silicone Soft Pad Thermal Gap Pad For Heat-Sink GPU Laptop Cooling 0

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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Gray 2.0W Thermal Insulation Silicone Soft Pad Thermal Gap Pad For Heat-Sink GPU Laptop Cooling

Gray 2.0W Thermal Insulation Silicone Soft Pad Thermal Gap Pad For Heat-Sink GPU Laptop Cooling

2.0W Silicone Soft Pad

Gray Silicone Soft Pad

Heat-Sink Silicone Soft Pad

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad