Name: Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF700UU
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF700UU

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contact Now

Detailed Product Description

Products Name:	Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers	Thermal Conductivity:	10.0W/m-K
Thickness Range:	0.75-5.0mmT	Keywords:	Thermal GAP PAD Materials
Application:	AI Servers, Inverters, Telecom Devices	Color:	Gray
Breakdown Voltage（V/mm)）:	≥4000	Fire Rating:	UL94 V-0
Dielectric Constant @1MHz:	7.0	Construction:	Ceramic Filled Silicone Elastomer

Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

The TIF^®700UU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large_tolerances,uneven surfaces,and the susceptibility of delicate components to mechanical damage.

Features:

> Good thermal conductivity: 10.0W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

Typical Properties of TIF^®700UU Series
Property	Value		Test method
Color	Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.3		ASTM D792
Thickness Range(inch/mm)	0.030 (0.75)	0.040~0.200 (1.00~5.00)	ASTM D374
Hardness (Shore OO)	30/10	30/10	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥4000		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	10.0 W/m-K		ASTM D5470
	10.0 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.030"(0.75 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

The TIF^® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers 0

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units

Products name: Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units

Application: automotive Engine Control Units

Feature: Soft and Naturally tacky needing no further adhesive coating

Hardness: 45 Shore 00

Compressible Silicone Thermal Pad 13.0W/mK High Conductivity Micro Heat Pipe Thermal Solutions

Products name: Compressible Silicone Thermal Pad 13.0W/mK High Conductivity Micro Heat Pipe Thermal Solutions

Color: Gray

thermal conductivity: 13.0W/mK

Application: Micro Heat Pipe Thermal Solutions

China Manufacturer High Thermal Conductivity 13.0W Gray Silicone Thermal Pad

Products name: China Manufacturer High Thermal Conductivity 13.0W Gray Silicone Thermal Pad

Color: Gray

thermal conductivity: 13.0W/mK

Hardness(shore 00): 35

Garnet Telecommunication Hardware Naturally Tacky 6.2 W Silicon Thermal Pad 0.25-5.08mm Thickness

color: garnet

thermal conductivity: 6.2W/mK

lead time: 3-7 work days

thickness: 0.25-5.08mm

Ultra Soft Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Products name: Ultra Soft Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Thickness range: 0.25-5.0mmT

Keywords: Thermally Silicone Pad

Color: Dark Gray

Thermal GAP PAD Materials Thermally Gap Pad For Computer CPU GPU Cooling

Products name: Thermal GAP PAD Materials Thermally Gap Pad For Computer CPU GPU Cooling

Applicatioon: Computer CPU GPU Cooling

Thermal conductivity: 5.0W/m-K

Color: Dark Gray

Good Flexibility And Fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Products name: Good Flexibility And Fillability Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Color: Pink

Construction: Ceramic filled silicone elastomer

Specific Gravity: 3.3g/cc