Name: 6.5W/MK Silicone-Based Thermal Management Thermal GAP PAD Materials For Network Communication Products
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF500-65-11ES
Price: 4.10 USD
Availability: InStock

Home Products Heat Sink Thermal Pad

6.5W/MK Silicone-Based Thermal Management Thermal GAP PAD Materials For Network Communication Products

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF500-65-11ES

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contact Now

Detailed Product Description

Products Name:	6.5W/MK Silicone-Based Thermal Management Thermal GAP PAD Materials For Network Communication Products	Sample:	Sample Free
Breakdown Voltage（V/mm）:	≥5500	Fire Rating:	94 V0
Color:	Dark Gray	Thermal Conductivity:	6.5W/m-K
Keywords:	Thermal GAP PAD Materials	Dielectric Constant @ 1MHz:	7.0MHz
Thickness Range:	0.020"~0.200"(0.50mm~5.0mm)	Application:	Network Communication Products Cooling

6.5W/MK Silicone-Based Thermal Management Thermal GAP PAD Materials For Network Communication Products

Company Profile

A silicone thermal pad is a type of thermal interface material (TIM) which is highly conductive and comprises of conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Ziitek supply a wide range of silicone thermal pads with varying properties to suit every application.

The TIF^®500-65-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.

Features

> High thermal conductivity
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications

> Computer / communication equipment.
> Laptop / tablet / PC server.
> New energy power battery / vehicle equipment.
> Switching power supply / UPS.
> Video / security equipment.
> Any heating element and radiator.

> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)

> Photovoltaic
> Signal communication
> New energy vehicle

Typical Properties of TIF^®500-65-11ES Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.4		ASTM D792
Thickness Range(inch/mm)	0.020~0.030	0.040~0.200	ASTM D374
	(0.50~0.75)	(1.00~5.00)
Hardness	20 Shore 00	10 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥ 5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	6.5		ASTM D5470
	6.5		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness: 0.020" (0.50 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

6.5W/MK Silicone-Based Thermal Management Thermal GAP PAD Materials For Network Communication Products 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

6.5W/MK Silicone-Based Thermal Management Thermal GAP PAD Materials For Network Communication Products 1

Tag:

thermal interface material pad,

thermal heat transfer pads,

thermal laptop cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Thermal Management Materials 3.0W Silicone Head Sink Thermal Pad For Electric Parts Heat Transfer

ProductThermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Tran: Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer

Materials: Ceramic filled silicone elastomer / Fiberglass

Feature: Soft and Compressible for low stress applications

Thermal conductivity: 3.0 W/mK

Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Product name: Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Materials: Ceramic filled silicone elastomer

Feature: Ultra soft

Thermal conductivity: 3.0W/mK

High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling

Products name: High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling

Sample: Sample free

Breakdown Voltage（V/mm）: ≥5500

Thickness range: 0.010"~0.200"(0.25mm~5.0mm)

Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads

Products name: Consumer Electronics Thermally Conductive 2.0W/MK Thermal Gap Pads

Sample: Sample free

Fire rating: 94 V0

Application: Consumer Electronics Cooling

Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip

Products name: Any Heating Element And Radiator 3.0W Ultra Soft Thermal Pad Silicone Based Thermal Interface Material For Motherboard Chip

Keywords: Silicone Thermal Pad

Sample: Sample free

Fire rating: 94 V0

RoHS Compliant 1.5W/M.K Cooling Gap Filler Insulation Silicone pad Thermal Pad For New Energy Vehicle

Products name: RoHS Compliant 1.5W/M.K Cooling Gap Filler Insulation Silicone pad Thermal Pad For New Energy Vehicle

Keywords: Silicone Thermal Pad

Sample: Sample free

Fire rating: 94 V0

Custom 3.0W Ultra-Soft 0.5mm thickness High Thermal Conductive Silicon Pad For Graphics Card

Product name: Custom 3.0W Ultra-Soft 0.5mm thickness High Thermal Conductive Silicon Pad For Graphics Card

Materials: Ceramic filled silicone elastomer

Application: Graphics Card

Samples: Free Samples