Name: 5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-50-50S
Price: 4.10 USD
Availability: InStock

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5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF100-50-50S
Document:	TIF100-50-50S_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation	Keywords:	Thermal Gap Filler
Sample:	Sample Free	Fire Rating:	94 V0
Color:	Pink	Thermal Conductivity:	5.0W/m-K
Dielectric Constant@1MHz:	7.5	Breakdown Voltage（V/mm)）:	≥5500
Thickness Range:	0.010"~0.200"(0.25mm~5.0mm)	Application:	For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation

5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation

TIF^®100-50-50S Series is a well-balanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Key Features

Good thermal conductivity: 5.0W/mK
Moldability for complex parts
Soft and compressible for low stress applications
High tack surface reduces contact resistance
RoHS compliant
UL recognized

Applications

Computer / communication equipment
Laptop / tablet / PC server
New energy power battery / vehicle equipment
Switching power supply / UPS
Video / security equipment
Any heating element and radiator
Home appliance industry
Power module
Wearable device
Solar photovoltaic panel
Motherboard chip
Radiator
AI Processors AI Servers

Technical Specifications of TIF^®100-50-50S Series

Property	Value	Test Method
Color	Pink	Visual
Construction & Composition	Ceramic filled silicone elastomer	-
Density (g/cm³)	3.3	ASTM D792
Thickness Range (inch/mm)	0.010~0.020 \| 0.030~0.200 0.25~0.50 \| 0.75~5.00	ASTM D374
Hardness (Shore 00)	65 \| 45	ASTM 2240
Continuous Use Temp	-40 to 200℃	-
Breakdown Voltage (V/mm)	≥ 5500	ASTM D149
Dielectric Constant@1MHz	7.5	ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0×10¹²	ASTM D257
Thermal Conductivity (W/m-K)	5.0	ASTM D5470 / ISO22007
Fire Rating	V-0	UL 94 (E331100)

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm ×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

5.0W/mK Thermal Gap Filler Suitable For AI Processors And Electronic Devices Requiring Heat Transfer And Insulation 0

Packaging & Lead Time

Packaging Details:
• PET film or foam for protection
• Paper card to separate each layer
• Export carton inside and outside
• Customized to meet customer requirements

Lead Time: Quantity: 5000 pieces - To be negotiated

Frequently Asked Questions

Q: Are you a trading company or manufacturer?
A: We are manufacturer in China.
Q: What thermal conductivity test method was used?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: How do I place an order?
A: Click the "Send messages" button, fill out the form with your questions and purchase requests, and we will reply as soon as possible via email or online.

About Ziitek

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective thermal management solutions. Our facilities include advanced production equipment, full test equipment, and fully automatic coating production lines supporting production of high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, and thermal grease. All products are UL94 V-0, SGS and ROHS compliant.

Tag:

thermal interface material pad,

thermal heat transfer pads,

thermal laptop cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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