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Thermal Management Solution Silicone Thermal Pad Designed To Reduce Thermal Resistance And Improve Device Longevity

Thermal Management Solution Silicone Thermal Pad Designed To Reduce Thermal Resistance And Improve Device Longevity

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF200-30-50S
Document: TIF200-30-50S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: Thermal Management Solution Silicone Thermal Pad Designed To Reduce Thermal Resistance And Improve Device Longevity Keywords: Silicone Thermal Pad
Color: Pink Thermal Conductivity: 3.0W/mK
Hardness (Shore 00): 70/45 Flame Rating: UL 94 V-0
Density: 3.0g/cm³ Thickness Range: 0.010~0.20 Inch(0.25mm~5.0mm)
Sample: Free Sample Application: O Reduce Thermal Resistance And Improve Device Longevity
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Thermal Management Solution Silicone Thermal Pad
Product Overview

Designed to reduce thermal resistance and improve device longevity, the TIF®️200-30-50S Series combines high thermal conductivity with reliable electrical insulation and soft characteristics for optimal thermal management.

Company Profile

Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong. As a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products, the company has established production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam to ensure efficient delivery and localized services globally.

Zhaoke's product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, widely used in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields.

Certifications

ISO9001:2015 • ISO14001:2004 • IATF16949:2016 • IECQ QC 080000:2017 • UL

Product Description

The TIF®️200-30-50S Series is a compound thermal interface material that combines high thermal conductivity, reliable electrical insulation, and soft characteristics. This product not only provides high thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits.

Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation, such as power devices, new energy vehicles, and portable electronic devices.

Key Features
  • High thermal conductivity
  • Good softness and fillability
  • Self-adhesive without the need for additional surface adhesives
  • High insulation performance
  • Puncture-resistant, tear-resistant, and scratch-resistant performance
Applications
  • Semiconductor automated test equipment (ATE)
  • CPU cooling solutions
  • Display card thermal management
  • Motherboard thermal interface
  • Power Electronics
  • Consumer Electronics
  • Industrial Control
  • New Energy
  • Routers
  • AI server
  • Medical equipment
  • Unmanned aerial vehicle (UAV)
  • Robot
  • Wireless Charger
Technical Specifications of TIF®️200-30-50S
Property Value Test Method
Color (Silicone Cloth/Silicone) Pink Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.0 ASTM D792
Thickness Range 0.010" (0.25mm) / 0.020"~0.200" (0.50~5.00mm) ASTM D374
Hardness (Shore 00) 70 | 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity (W/m-K) 3.0 ASTM D5470
Product Specifications

Standard Thickness: 0.010" (0.25 mm) - 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm × 406 mm)

Component Codes:

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF®️ series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®ï¸200-30-50S Series Thermal Pad product image
Frequently Asked Questions

Are you a trading company or manufacturer?

We are a manufacturer with facilities in China and Vietnam.

How long is your delivery time?

Generally 3-7 work days for in-stock items, or 7-10 work days for non-stock items, depending on quantity.

What Is a Thermal Interface Material (TIM)?

Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.

What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?

Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.

What Is Thermal Resistance in Thermal Interface Materials?

Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.

What Is the Difference Between Thermal Conductivity and Thermal Resistance?

Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.

Does Higher Thermal Conductivity Always Mean Better Cooling?

Not necessarily. Thickness, interface contact, compression and actual thermal resistance can significantly affect final cooling performance.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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