3.0W/mK High Compressibility Thermal Pad Suitable for power supplies, LED lighting and other heat-sensitive equipment
Company Profile
Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong. As a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products, the company has established production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam to ensure efficient delivery and localized services globally.
Zhaoke's product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, widely used in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields. The company holds IATF16949 and ISO9001 certifications, with products meeting ROHS, REACH and UL specifications.
Certifications
ISO9001:2015 • ISO14001:2004 • IATF16949:2016 • IECQ QC 080000:2017 • UL
Product Description
The TIF®️200-30-12S Series is a compound thermal interface material that combines excellent thermal conductivity, reliable electrical insulation, and soft characteristics. This product provides superior breakdown voltage strength to prevent circuit short circuits while its soft properties allow complete filling of uneven interfaces, offering excellent cushioning protection for precision components during heat dissipation.This series is ideal for applications requiring electrical isolation in power devices, new energy vehicles, and portable electronic devices.
Key Features
- Excellent thermal conductivity
- Superior softness and fillability
- Self-adhesive without additional surface adhesives
- Reliable insulation performance
- Puncture-resistant, tear-resistant, and scratch-resistant
Applications
- Automotive electronics
- Battery packs for electric vehicles
- LED drivers and lamps
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
- CPU cooling solutions
- Display card thermal management
- Motherboard thermal interface
- Power Electronics
- Consumer Electronics
- Industrial Control
- New Energy
Technical Specifications of TIF®️200-30-12S Series
| Property |
Value |
Test Method |
| Color(Silicone Cloth/Silicone) |
Yellow/Blue |
Visual |
| Construction |
Ceramic filled silicone elastomer |
ZKTM J024 |
| Density (g/cm³) |
3.0 |
ASTM D792 |
| Thickness Range |
0.010" (0.25mm) - 0.200" (5.00mm) |
ASTM D374 |
| Hardness (Shore 00) |
70 | 45 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
ZKTM J025 |
| Breakdown Strength (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
4.5 |
ASTM D150 |
| Volume Resistivity (Ohm-meter) |
＞1.0×10¹² |
ASTM D257 |
| Flame Rating |
V-0 |
UL 94 (E331100) |
| Thermal Conductivity (W/m-K) |
3.0 |
ASTM D5470 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm) - 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm × 406 mm)
Component Codes:
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF®️ series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer with facilities in China and Vietnam.
How long is your delivery time?
Generally 3-7 work days for in-stock items, or 7-10 work days for non-stock items, depending on quantity.
What Is a Thermal Interface Material (TIM)?
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
What Is Thermal Resistance in Thermal Interface Materials?
Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
What Is the Difference Between Thermal Conductivity and Thermal Resistance?
Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.
Does Higher Thermal Conductivity Always Mean Better Cooling?
Not necessarily. Thickness, interface contact, compression and actual thermal resistance can significantly affect final cooling performance.
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