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TIF015AB-07S

thermal gel
December 30, 2024
Category Connection: Thermal Conductive Gel
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Tags:
#heat transfer putty #thermally conductive gap filler #heat insulation putty
Brief: Discover the TIF015AB-07S Thermally Conductive Putty for CPU and GPU applications. This high-performance thermal solution from Ziitek ensures efficient heat dissipation, enhancing the longevity and performance of electronic components. Ideal for notebooks, set-top boxes, and more.
Related Product Features:
  • High thermal conductivity of 1.5W/mK for effective heat dissipation.
  • UL recognized for safety and reliability.
  • Naturally tacky, eliminating the need for additional adhesive coatings.
  • Two-part formulation ensures easy storage and handling.
  • High durability for long-term performance.
  • Optimized shear thinning characteristics for easy dispensing.
  • Suitable for a wide temperature range from -45°C to 200°C.
  • Available in custom packaging for automated dispensing applications.
Faqs:
  • What is the thermal conductivity of TIF015AB-07S?
    The TIF015AB-07S has a thermal conductivity of 1.5W/mK, making it highly effective for heat dissipation in electronic devices.
  • Is the TIF015AB-07S suitable for high-temperature applications?
    Yes, the TIF015AB-07S can withstand continuous use temperatures ranging from -45°C to 200°C, making it ideal for high-temperature environments.
  • What packaging options are available for TIF015AB-07S?
    The product is available in 50cc/pc and 400cc/pc packaging, with custom options like syringes for automated dispensing. Contact us for specific packaging needs.
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