Electronic Industry 2.3 G/CC Silicon Thermal Pad 0.02-0.2mmT For AI Server

Electronic Industry 2.3 G/CC Silicon Thermal Pad 0.02-0.2mmT For AI Server

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

The TIF180-02F Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 
Features
 

> RoHS compliant 1.5W/mK
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating
> High durability

Applications

> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> mainboard/mother board
> Notebook