TIC thermal conductive phase change materials: an indispensable new engine for heat dissipation in the age of AI

With AI technology changing with each passing day, high-performance computing devices are driving the wave of scientific and technological progress at a fast speed. However, with the leap in processing power, thermal management becomes a key factor restricting the performance release of AI devices. It is in this context that high-performance thermally conductive phase change materials emerge at the right moment and become the right-hand man of AI equipment for effective heat dissipation.

With its unique phase change characteristics, high-performance thermal conductive phase change materials can quickly absorb and conduct heat when the equipment temperature increases, effectively reducing the working temperature of core components. This intelligent temperature control mechanism not only ensures the stability of AI equipment under long and high load operation, but also releases its computing potential and makes every data processing more rapid and accurate.

Thermal conductive phase change material properties
1, thermal conductivity: 0.95W -- 5.0W/mK
2, room temperature with natural viscosity, no adhesive
3. Good liquidity and no spillover

For AI devices, core components such as processors and GPus are like their hearts. Overheating may lead to performance degradation or even damage. High-performance thermally conductive phase change materials, with their thermal conductivity and tight-fitting design, are able to accurately control the temperature in these critical areas, providing all-round protection for the heart of the AI device and ensuring its stable operation under any challenge.

In the pursuit of effective heat dissipation, high-performance thermal conductivity phase change materials also take into account the concept of green energy saving. By optimizing heat conduction paths and reducing energy loss, it helps AI devices improve performance while also reducing operating costs and environmental burdens. This is not only the pursuit of technological progress, but also the expression of responsibility for sustainable development in the future.