Phase Changing Materials Providing Low Thermal Impedance and High Thermal Conductivity for Electronic Thermal Interfaces

Phase Changing Materials Providing Low Thermal Impedance and High Thermal Conductivity for Electronic Thermal Interfaces

Ziitek, founded in 2006, has been deeply involved in the field of thermal management for many years and is a high-tech enterprise integrating R&D, production, and sales. With the rapid development of industries such as new energy vehicles, energy storage systems, high-performance CPU/GPU chips, AI intelligent automation, 5G communication, and aerospace, Ziitek has developed a wide range of products — including thermal pads, thermal pastes, phase change materials, EMI shielding materials, heating films, and foamed silicone seals — through continuous independent innovation by senior engineers. These products accurately match the heat dissipation and sealing needs of various industries. Headquartered in Dongguan, the company has established production bases in Kunshan, Taiwan Province, and Vietnam to quickly respond to global customers.

The TIC^®800G Series is a thermally conductive phase change material with high reliability and high thermal conductivity. It is solid at room temperature, facilitating operation and installation. When it reaches a specific phase transition temperature, the material softens and becomes semi-fluid, fully filling the microscopic gaps between the heat-generating interface and the heat sink. This significantly reduces contact thermal resistance and achieves good heat transfer efficiency. This material can solve the heat dissipation problem of medium and high power density electronic devices under transient or steady-state operation.

• High thermal conductivity
• Soft surface
• Low thermal resistance
• Self-adhesive — no additional adhesive required

• High Frequency Microprocessors
• Notebook and Desktop PCs
• Computer Servers
• Memory Modules
• Cache Chips
• IGBTs

0.004" (0.10 mm), 0.005" (0.13 mm), 0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm)

11.811" × 19.685" (300 mm × 500 mm)

Pressure-sensitive adhesive: Not applicable to TIC® series products.

The TIC® series can be die-cut into different shapes. If you need different thicknesses and specifications, or would like to learn more about thermal conductive materials, please contact our company.

1. With PET film or foam for protection
2. Use paper card to separate each layer
3. Export carton inside and outside
4. Customized to meet customers' requirements

Lead Time: Quantity (Pieces): 5000 — Estimated Time (days): To be negotiated