Name: Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIC800G
Price: 4.10 USD
Availability: InStock

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Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	RoHS
Model Number:	TIC800G

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	242312cm
Delivery Time:	3-6 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Name:	Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules	Color:	Gray
Keyword:	Phase Change Materials	Feature:	Low Melting Point
Thermal Conductivity:	5W/mK	Applicatoin:	Memory Modules
Highlight:	outlast phase change material , phase change thermal pad , 5W/mK PCM Phase Change Material

Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

TIC800G-Serice-Datasheet-REV01.pdf

Features

> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required

Applications

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TIC^TM800G Series
Product Name	TIC^TM805G	TIC^TM808G	TIC^TM810G	TIC^TM812G	Test Method
Color	Gray	Gray	Gray	Gray	Visual
Thickness	0.005"	0.008"	0.010"	0.012"	****
Thickness	(0.126mm)	(0.203mm)	(0.254mm)	(0.305mm)	****
Thickness Tolerance	±0.0005''	±0.0008''	±0.0010''	±0.0012''	****
Thickness Tolerance	(±0.127mm)	(±0.203mm)	(±0.0254mm)	(±0.0305mm)	****
Density	2.6g/cc				Helium Pycnometer
Temperature range	-25℃～125℃				****
Phase Change Softening Temperature	50℃~60℃				****
Thermal Conductivity	5.0 W/mK				ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa)	0.014℃-in²/W	0.020℃-in²/W	0.038℃-in²/W	0.058℃-in²/W	ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa)	0.09℃-cm²/W	0.13℃-cm²/W	0.25℃-cm²/W	0.37℃-cm²/W	ASTM D5470 (modified)

Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)

Consult the factory alternate thickness.

Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400'(406mm x 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800G series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800G series products.

Reinforcement:
No reinforcement is necessary.

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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