TIM thermal interface materials: the core driving force of industrial computer heat dissipation solutions

With the rapid development of artificial intelligence (AI), machine vision, Internet of Things (IoT) new retail, intelligent transportation and other industries, the demand for industrial automation continues to grow. In these application scenarios, industrial computer plays a crucial role as the central control brain. In the heat dissipation solution of industrial computer, it is very important to select the thermal conductive interface material. This kind of material is mainly used to fill the small gap between the heating element and the heat dissipation device, so as to reduce the contact thermal resistance and improve the heat dissipation efficiency.

Thermally conductive interface materials play an important role in the heat dissipation of industrial computers. ZIITEK Technology has launched a comprehensive product matrix, covering thermal conductive pad, thermal conductivity gel, thermal conductivity silicone grease and thermal conductivity phase change materials and other materials, through the selection and application of suitable thermal conductivity interface materials, so that they are directly connected to the external radiator, so as to effectively take away the heat generated by CPU and other electronic components, effectively improve the heat dissipation performance of industrial computer. Ensure its stable operation in complex environment.

TIF thermal conductivity pad:
Good thermal conductivity: 1.2W~25W/mK
Fire rating: UL94-V0
A variety of thickness options are available: 0.25mm-12.0mm
Hardness: 5~85shoreOO
High compressibility, soft and elastic, suitable for low pressure applications
Self-adhesive without additional surface adhesive

TIG thermal silicone grease:
Thermal conductivity: 1.0~5.2W/mK,
Fire rating: UL94-V0,
Excellent low thermal resistance,
Excellent long-term stability,
Non-toxic, environmentally friendly and safe, in line with ROHS standards
High thixotropic properties for easy handling
Well filled microscopic contact surfaces, creating low thermal resistance

TIF two-component thermal conductive gel:
Thermal conductivity: 1.5~5.0W/mK
Fire rating: UL94-V0
Two component material, easy to store
Excellent high and low temperature mechanical properties and chemical stability
Curing time can be adjusted according to temperature
The thickness can be adjusted by automatic equipment
Can be easily used in dispensing system, automatic operation

TIC thermal conductive phase change material:
Thermal conductivity: 0.95W~7.5W/mK
The unique technology avoids additional pumping after the initial heating cycle
The product is naturally sticky, without adhesive coating, and does not need radiator preheating when laminating
Low thermal resistance at low pressure

The supply situation is the coil material with liner, which is convenient for manual or automatic operation application

Summary: When selecting thermal conductive interface materials, it is necessary to consider the thermal conductivity, thickness, size, density, voltage resistance, temperature and other parameters of the product, as well as the specific requirements of the application. Sample testing is recommended to determine suitable thermal conductive interface materials. Therefore, selecting the appropriate thermal interface material will effectively improve the heat dissipation performance of the industrial computer and ensure the stable operation of the equipment.