High Performance Phase Change Material PCM Cooling Pad For Heat Pipe Thermal Solutions

The TIC^®800G Series is a high-reliability, high-thermal-conductivity phase change material (PCM) designed for demanding heat pipe and thermal management applications. Solid at room temperature for easy handling and installation, it softens into a semi-fluid state once it reaches its phase transition temperature, fully filling microscopic gaps between the heat-generating interface and the heat sink. This dramatically reduces contact thermal resistance and delivers excellent heat transfer efficiency, making it ideal for solving heat dissipation challenges in medium- and high-power-density electronic devices under transient or steady-state operation.

• High thermal conductivity
• Soft surface for excellent interface wetting
• Low thermal resistance
• Self-adhesive — no additional adhesive required

• High-frequency microprocessors
• Notebook and desktop PCs
• Computer servers
• Memory modules
• Cache chips
• IGBTs

Standard Thickness: 0.004" (0.10 mm), 0.005" (0.13 mm), 0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm)

Standard Size: 11.811" × 19.685" (300 mm × 500 mm)

Pressure-sensitive adhesive: Not applicable to TIC^® series products.

The TIC^® series can be die-cut into different shapes. For different thicknesses and specifications, or to learn more about our thermal conductive materials, please contact our company.

1. PET film or foam for protection
2. Paper card to separate each layer
3. Export carton inside and outside
4. Customized packaging to meet customer requirements

Lead Time: Quantity (Pieces): 5000 — Estimated Time (days): To be negotiated

Ziitek was founded in 2006 as a high-tech enterprise specializing in the research and development, manufacturing, and solution development of thermal conductive, heating, sealing, and EMI materials.

• Production Capacity Layout: Headquartered in Dongguan, Guangdong Province, with production bases in Kunshan (Jiangsu Province), Taiwan, and Vietnam. This global layout ensures rapid delivery.
• Application Fields: New energy vehicles, energy storage, high-performance chips, laptops, security, AI automation, 5G communication, and aerospace.
• Core Products: TIF thermal conductive pads series, Z-Paster non-silicon thermal conductive pads series, TIG thermal paste, TIC phase change thermal material, TIS thermal insulating material, TIA thermal double-sided adhesive, TIR high thermal conductivity conductive material, TIF900 series EMI materials, K-heat heating products (PI heating film, silicone heating sheet, PTC heater), Z-foam foaming silicone sealing parts, and TCP thermal engineering plastics.
• Quality Certification: IATF16949, ISO9001, ISO14001, QC080000; products comply with RoHS, REACH, and UL.

Ziitek gathers professional R&D engineers and implements a joint development model, deeply participating in the early design of customer products. We empower customers with technological innovation and are committed to becoming a trusted material strategic partner for global customers.