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Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets

Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets

  • Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets
  • Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets
Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TS-Ziitek-Sharp Metal X01
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-6 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets Applicatoin: Microprocessors Chipsets
Phase Change Temperature Range: >60℃ Composition: Alloy
Feature: Good Thermal Conductivity Keyword: Metal Phase Change Material
Thermal Conductivity: 18.9W/mK
Highlight:

Thermal Conductivity Metal Phase Changing Materials

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Microprocessors Chipsets Metal Phase Changing Materials

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Metal Phase Changing Materials

Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets

 

TS-Ziitek-Sharp Metal x01 is a new type of alloy phase changing heat conduction product made from a mixture of several metals, designed to solve heat dissipation and reliability problems.


TS-ZiiteK-Sharp Metal X01 is not easy to evaporate, safe and non-toxic, stable in physical and chemical properties, and has high thermal conductivity etc.When the phase change temperature is higher than its phase change temperature,the phase change material begins to softening and phase change, and can be filled to the tiny irregular contact surface of the device.Form a very small contact thermal resistance interface, to achieve good heat.

 

Features


>Good thermal conductivity
>Non-toxic and environmentally safe

>Excellent long term stability
>Ensure low thermal resistance.


Applications


>Microprocessors

>Chipsets

>Graphic processing chips

>Set Top Box
>LED

Typical Properties of TS-Ziitek-Sharp Metal X01 Series
Property Value Test Method
Color Silvery white Visual
Composition Alloy ****
Density (g/cm³) 8.0 ASTM D792 @25℃
7.9 ASTM D792 @80℃
Thermal conductivity(W/mK) 18.9 ISO22007-2.2 @25℃
15.3 ISO22007-2.2 @80℃
Specific heat capacity(J/g℃) 0.24 ASTM E1269@25℃
0.26 ASTM E1269@80℃
Resistivity (Ω-m) <10-7 ASTM D257
Continuous Use Temp(℃) -45 to 250℃ Ziitek Test Method
Phase Change Temperature Range(℃) >60 ASTM D3418
Solidification Range(℃) <57 ASTM D3418

Storage Method
Recommended storage in a warehouse environment at 18-30°C, with maximum humidity notexceeding 70%.


Usage lnstructions
Avoid contact with aluminum or metal surfaces.
After applying X01, use a compatible thermal pad or foam to enclose and secure the area along the edges of the liquid metal, ensuring it remains contained without leaking or spreading.

Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets 0

Company Profile
 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets 1

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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