Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets

Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets

TIC^®800M is a new type of phase change thermal conductivity product made by mixing multiple metals, designed specifically to solve heat dissipation problems and improve application reliability. This material has high thermal conductivity,is not easy to evaporate,is safe and non-toxic, and has stable physical and chemical properties. When the temperature is higher than its phase transition temperature, the material will soften  and undergo phase transition, which can tightly fill the small irregular contact surfaces on the device surface, forming a low contact thermal resistance thermal interface, thereby achieving excellent heat dissipation effect.

Features

> Excellent thermal conductivity
> Non toxic, environmentally friendly, and safe, meeting RoHS requirements
> Excellent long-term stability
> Thoroughly fill the contact surface to create low thermal resistance
> Not easily volatile

Applications

> Microprocessors

> Chipsets

> Graphic processing chips

> Set Top Box
> LED TV and LED lighting fixtures

Packaing:
TIC^®800M can be packaged according to customer requirements.

Usage Instructions:
After using this material, it is recommended to use suitable foam or gaskets to enclose the edges of the phase change metal,
ensuring that the material does not disperse or spread.
For more information about thermal conductive materials, please contact our company.