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UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad

UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad

UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad
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UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF100-30-50U
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Product Name: UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad Materials: Ceramic Filled Silicone Elastomer
Feature: Ultra Soft Thermal Conductivity: 3.0 W/mK
Application: CPU, Display Card ,heat Sink Keyword: Thermal Pad
Specific Gravity: 3.0 G/cm³
Highlight:

thermal interface material pad

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27shore00 Heat Sink Thermal Pad

UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

The TIF™100-30-50U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
 
Features
 
> Good thermal conductive: 3 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
 
Applications
 
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
 
 
Typical Properties of TIF 100-30-50U
Product Name
TIF 100-30-50U Series
Colour
Pink
Construction & Compostion
Ceramic filled silicone rubber
Specific Gravity
3.0 g/cm³
Hardness
27±5 Shore 00
Tensile Strength
40 psi
Continuos Use Temp
-40 to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Volume Resistivity ≥1.0*10¹²Ohm-cm
Thermal conductivity
3.0 W/mK
Thickness
0.5mm to 5.0mmT
Flame Rating 94-V0

 

Standard Thicknesses:
0.010" (0.25mm),0.020" (0.51mm),0.030" (0.76mm),0.040" (1.02mm),0.050" (1.27mm),

0.060" (1.52mm),0.070" (1.78mm),0.080" (2.03mm),0.090" (2.29mm)  0.100" (2.54mm),

0.110" (2.79mm),0.120" (3.05mm),0.130" (3.30mm),0.140"  (3.56mm),0.150" (3.81mm),

0.160" (4.06mm),0.170" (4.32mm),0.180" (4.57mm),0.190" (4.83mm),0.200" (5.08mm)
Consult the factory alternate thickness.
 
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
 
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
 
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

 
UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad 0
 
FAQ:
 
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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