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China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU

China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU

China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU
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China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF1100-07E Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Thickness Range: 0.020"(0.5mm)-0.200"(5.0mm) Color: Green
Dielectric Constant: 4.7MHz Dielectric Breakdown Voltage: >5500 VAC
Fire Rating: 94 V0 Thermal Conductivity: 1.5W/m-K
High Light:

5.5MHz Thermal Conductive Gap Filler Pad

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ISO14001 Silicone Thermal Pad

China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

The TIF1100-07E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> Easy release construction
> Broad range of hardnesses available

> High tack surface reduces contact resistance
> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
 

Applications
LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> display card

> Micro heat pipe thermal solutions
> Memory Modules

routers

Telecommunication hardware

> Heat pipe thermal solutions

>GPS navigation and other portable devices

>Audio and video components 

 

 

 
                                            Typical Properties of TIF1100-07E Series
 
Color
Green
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.3 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.020"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
35 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 

>5500 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

 

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.7MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20

 

Volume Resistivity
1.0X10"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Standard Sheets Sizes:


8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

 

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU 0

 

 

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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