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| Place of Origin: | China |
| Brand Name: | Ziitek |
| Certification: | UL & RoHS |
| Model Number: | TIF700HP Series |
| Minimum Order Quantity: | 1000pcs |
|---|---|
| Price: | 0.1-10 USD/PCS |
| Packaging Details: | 24*23*12cm cantons |
| Delivery Time: | 3-5 work days |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 pcs/month |
| Thickness: | 30-400mils | Specific Gravity: | 3.5 G/cc |
|---|---|---|---|
| Dielectric Breakdown Voltage: | 5.5KV | Thermal Conductivity: | 7.5W/m-K |
| Color: | Gray | Operating Temp: | -40~160℃ |
| Flame Rating: | UL94V0 | ||
| Highlight: | 7.5W/MK Silicone Heat Conductive Pad,Silicone Thermal Pad For LED TV,7.5W/MK Silicone Thermal Pad |
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Professional factory supply varies thicknesses 7.5W/MK silicone thermal pad TIF700HP for LED TV and LED-lit lamps
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
TIF700HP Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features
> Outstanding thermal performance: 7.5W/mK
>Available in varies thicknesses
> Naturally tacky needing no further adhesive coating
> Moldability for complex parts
>High durability
>Easy release construction
Applications
| Telecommunication hardware |
| Handheld portable electronics |
| Semiconductor automated test equipment (ATE) |
| CPU |
| display card |
| mainboard/mother board |
| notebook |
| power supply |
| Heat pipe thermal solutions |
| Memory Modules |
| Mass storage devices |
| Typical Properties of TIF700HP Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | *** |
| Specific Gravity | 3.5 g/cc | ASTM D297 |
| Thickness range | 0.030"-0.400" | ASTM C351 |
| Dielectric Breakdown Voltage | 5.5KV | ASTM D412 |
| Continuos Use Temp | -40 to 160℃ | *** |
| Outgassing(TML) | 0.30% | ASTM E595 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 5.2X10" Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 7.5W/m-K | ASTM D5470 |
Standard Sheets Sizes:
10" x 16"(254mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Q&A
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Contact Person: Dana Dai
Tel: +86 18153789196
