| Place of Origin: | China |
| Brand Name: | Ziitek |
| Certification: | UL |
| Model Number: | TIF140-30-11ES thermal pad |
| Document: | TIF100-30-11ES_Data Sheet.pdf |
| Minimum Order Quantity: | 1000 pcs |
|---|---|
| Price: | 0.1-10 USD/PCS |
| Packaging Details: | 24*13*12cm cartons |
| Delivery Time: | 3-8 work days |
| Payment Terms: | T/T |
| Supply Ability: | 100000pcs/month |
| Prodducts Name: | 3.0W/MK Electrically Isolating RoHS Silicone Thermal Sheets 1.0 MmT For Heat Pipe Thermal Solutions | Hardness: | 12 Shore00 |
|---|---|---|---|
| Keywords: | Silicone Thermal Sheets | Color: | Dark Gray |
| Thermal Conductivity: | 3.0W/mK | Material: | Ceramic Filled Silicone Elastomer |
| Thickness: | 1.0mmT | Application: | For Heat Pipe Thermal Solutions |
| Sample: | Free | ||
| Highlight: | 3.0W/MK Silicone Sheets,RoHS Compliant Silicone Sheets,Electrically Isolating Silicone Sheets |
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3.0W/MK Electrically Isolating RoHS Silicone Thermal Sheets 1.0 MmT For Heat Pipe Thermal Solutions
Company Profile
Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.
Products description
The TIF®100-30-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.
| Typical Properties of TIF®100-30-11ES Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) |
3.15 |
ASTM D792 | |
| Thickness Range(inch/mm) |
0.020~0.030 (0.50~0.75) |
0.040~0.200 (1.00~5.00) |
ASTM D374 |
| Hardness (Shore 00) | 12 | 12 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | *** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1MHz | 7.0 | ASTM D150 | |
| Volume Resistivity | >1.0X1012Ohm-meter | ASTM D257 | |
| Thermal Conductivity (W/m-K) | 3.0 | ASTM D5470 | |
| 3.0 | ISO22007 | ||
| Fire rating | V-0 | UL 94 (E331100) | |
Product Specifications
Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
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Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Contact Person: Dana Dai
Tel: +86 18153789196