Soft Ideal Thermal Pads 2.5mm Thickness Thermal Conductivity 7.5W/M.K With Self-Adhesive For Repairing And Cooling Electronics

Company Profile

Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

Products description

The TIF^®700PES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with a near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure,completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and highest heat flux electronic components.

Features:

>Excellent thermal conductivity
>Extremely soft,low compression stress effectively protects sensitive components
>Self-adhesive without the need for additional surface adhesives
>High insulation performance

> AI Servers

> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

Product Specifications

Standard Thickness: 0.020"(0.50 mm)~ 0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

The TIF^® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.