| Place of Origin: | China |
| Brand Name: | Ziitek |
| Certification: | UL |
| Model Number: | TIF7160PES thermal pad |
| Minimum Order Quantity: | 1000 pcs |
|---|---|
| Price: | 0.1-10 USD/PCS |
| Packaging Details: | 24*13*12cm carton |
| Delivery Time: | 3-8 work days |
| Payment Terms: | T/T |
| Supply Ability: | 100000pcs/month |
| Prodcuts Name: | China Customized Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad For GPU Laptop | Keyword: | Thermally Conductive Pad |
|---|---|---|---|
| Density: | 3.4g/cm³ | Hardness (Shore 00): | 55/10 |
| Thickness: | 4.0mmT | Thermal Conductivity (W/m-K): | 7.6 |
| Breakdown Voltage(V/mm): | ≥5500 | Application: | GPU Laptop |
| Highlight: | High Temperature Resistant Thermal Pad,Customized Thermal Pad,GPU Laptop Thermal Pad |
||
China Customized Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad For GPU Laptop
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
![]()
Products description
Ziitek TIF®7160PES is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features:
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
| Typical Properties of TIF®700PES Series | |||
| Property | Value | Test method | |
| Color | Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.4 | ASTM D792 | |
| Thickness Range(inch/mm) |
0.020~0.030 (0.50~0.75) |
0.040~0.200 (1.0~5.00) | ASTM D374 |
| Hardness | 55 Shore 00 | 10 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.6 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 7.5 W/m-K | ASTM D5470 | |
| 7.5 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.020"(0.50 mm)~ 0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
![]()
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Contact Person: Dana Dai
Tel: +86 18153789196