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Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card

Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card

Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card
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Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF100-30-05E
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Product Name: Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics Card Materials: Ceramic Filled Silicone Elastomer / Fiberglass
Application: Electric Parts Heat Transfer Samples: Free Samples
Keywords: Silicone Thermal Pad Thermal Conductivity: 3.0 W/mK
Feature: Ultra-Soft High Thermal Conductive Silicon Pad
Highlight:

3.0W High Thermal Conductive Silicon Pad

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Custom High Thermal Conductive Silicon Pad

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Ultra-Soft Thermal Conductive Silicon Pad

Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

The TIF™100-30-05E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

TIF100-30-05E-Datasheet-REV02.pdf

 

Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card 0

 

 

Features

● Available in varies thicknesses 3.0W/mK
● Broad range of hardnesses available
● Moldability for complex parts
● Outstanding thermal performance

 

Applications

● CPU
● display card
● mainboard/mother board
● notebook
● power supply
● Heat pipe thermal solutions
● Memory Modules
● Mass storage devices
● Automotive electronics

 

Typical Properties of TIF100-30-05E

 

Color Blue Visual Dielectric Breakdown Voltage (T= 1mm above) >5500 VAC ASTM D149
Construction Ceramic filled silicone elastomer ********** Dielectric Constant 5.0 MHz ASTM D150
Thermal Conductivity 3.0W/mK ASTM D5470 Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Hardness 35 Shore 00 ASTM 2240 Continuous Use Temp –40 ~160 ℃ **********
Specific Gravity 3.0 g/cc ASTM D297 Outgassing (TML)

0.40%

ASTM E595
Thickness range 0.020"-0.200"(0.5mm-5.0mm) ASTM D374 Flame Rating 94 V0 UL E331100

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card 1

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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