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6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS

6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS

6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS
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6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TS-TIF100C 6530-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Features: Good Chemical Stability Products Name: 6.5W High Quality Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS
Keywords: Thermal Gap Filler Hardness: 30 Shore 00
Thinkness Range: 0.012"(0.30mm)~0.200"(5.00mm) Color: Gray
Flam Rating: 94 V-0 Thermal Conductivity: 6.5W/mK
Application: Laptop Heatsink LED CPU GPU MOS
Highlight:

Thermal Gap Filler Insulation Sheet

,

LED Silicone Thermal Pad

,

Customized Silicone Thermal Pad

6.5W High Quality Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TS-TIF ®100C 6530-11 Series is a silicone-based thermal material designed to fill the gapsbetween heat-generating components and liquid cooling plates or metal bases. lts flexibility andelasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, itefficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metalheat dissipation structures, thereby improving the cooling efficiency of high-power electroniccomponents and extending the lifespan of the equipment.

 

Features:
> Excellent thermal conductivity 6.5W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant


Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Typical Properties of  TS-TIF ®100C 6530-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.4g/cc ASTM D792
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 30 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 7.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0

UL94(E331100)

Thermal conductivity 6.5W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

Product Specification:
Product Thicknesses: 0.012"(0.30mm)~0.200"(5.00mm)
Product Sizes: 8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.For more information, refer to the Material Safety Data Sheet .
6.5W High Quality Customized Silicone Thermal Pad Thermal Gap Filler Insulation Sheet For LED CPU GPU MOS 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

 

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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