Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling

Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Product description

TIF100-66U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive : 1.0W/mK
> Soft and Compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thickness

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Display card
> Telecommunication hardware
> Display card
> Mass storage devices
> Automotive electronics
> Set top boxes