Name: Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF700PU
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF700PU

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	242312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contact Now

Detailed Product Description

Products Name:	Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers	Thermal Conductivity:	7.5W/m-K
Application:	AI Servers AI Processors	Thickness Range:	0.5-5.0mmT
Keywords:	Silicone Thermal Pad	Dielectric Constant @1MHz:	4.5
Color:	Gray	Breakdown Voltage（V/mm)）:	≥5500
Fire Rating:	UL94 V-0	Construction:	Ceramic Filled Silicone Elastomer

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

The TIF^®700PU Series an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.

Features

> Excellent thermal conductivity:7.5 W/mK

> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

Typical Properties of TIF^®700PU Series
Property	Value		Test method
Color	Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.45		ASTM D792
Thickness Range(inch/mm)	0.020~0.030 (0.50~0.5)	0.040~0.200 (1.0~5.0)	ASTM D374
Hardness (Shore OO)	70	27	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	7.5 W/m-K		ASTM D5470
	7.5 W/m-K		ISO22007

Product Specifications

Standard Thickness:0.02" (0.50 mm)~0.20" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (203 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Multiple Thickness CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units

Products name: Wholesale 5.0W Gray Silicone Thermal Pad For Automotive Engine Control Units

Application: automotive Engine Control Units

Feature: Soft and Naturally tacky needing no further adhesive coating

Hardness: 45 Shore 00

Compressible Silicone Thermal Pad 13.0W/mK High Conductivity Micro Heat Pipe Thermal Solutions

Products name: Compressible Silicone Thermal Pad 13.0W/mK High Conductivity Micro Heat Pipe Thermal Solutions

Color: Gray

thermal conductivity: 13.0W/mK

Application: Micro Heat Pipe Thermal Solutions

China Manufacturer High Thermal Conductivity 13.0W Gray Silicone Thermal Pad

Products name: China Manufacturer High Thermal Conductivity 13.0W Gray Silicone Thermal Pad

Color: Gray

thermal conductivity: 13.0W/mK

Hardness(shore 00): 35

Garnet Telecommunication Hardware Naturally Tacky 6.2 W Silicon Thermal Pad 0.25-5.08mm Thickness

color: garnet

thermal conductivity: 6.2W/mK

lead time: 3-7 work days

thickness: 0.25-5.08mm

Thermal Silicone Pad 7.5W High Conductivity Heat Dissipation Sheet For AI Server

Products name: Thermal Silicone Pad 7.5W High Conductivity Heat Dissipation Sheet For AI Server

Construction: Ceramic filled silicone elastomer

Thickness range: 0.5-5.0mmT

Keywords: Thermal Pad

Ultra Soft Termal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors

Products name: Ultra Soft Termal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors

Construction: Ceramic filled silicone elastomer

Thickness range: 0.5-5.0mmT

Keywords: Thermal Pad

Good Insulation Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Products name: Good Insulation Ultra High Thermal Conductivity Gap Filler Pad For AI Servers

Application: AI Servers

Thickness range: 0.5-5.0mmT

Keywords: Thermal Gap Filler Pad