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Thermal Conductivity Of 3.0W/Mk Ultra Soft High-Performance Silicone Gap Pads For 5G Aerospace AI AIoT And Automotive

Thermal Conductivity Of 3.0W/Mk Ultra Soft High-Performance Silicone Gap Pads For 5G Aerospace AI AIoT And Automotive

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF100 3030-06
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: Thermal Conductivity Of 3.0W/Mk Ultra Soft High-Performance Silicone Gap Pads For 5G Aerospace AI AIoT And Automotive Construction: Ceramic Filled Silicone Elastomer
Thickness: 0.25-5.0mmT Thermal Conductivity: 3.0W/m-K
Specific Gravity: 3.0 G/cc Dielectric Breakdown Voltage: >5500 VAC
Keywords: Ultra Soft Thermal Pad Application: 5G Aerospace AI AIoT And Automotive

Thermal Conductivity Of 3.0W/Mk Ultra Soft High-Performance Silicone Gap Pads For 5G Aerospace AI AIoT And Automotive

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

 

Features

 

> Good thermal conductive: 3.0W/mK
> Ultra-soft and highly conformable
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance


Applications

 

Electronic Components,5G,Aerospace,AI, AIoT, AR/VR/MR/XR, Automotive,
Consumer Devices,Datacom,Electric Vehicle,Electronic Products,Energy
Storage,Industrial, Lighting Equipment,Medical, Military,Netcom,Panel, Power
Electronics,Robot,Servers,Smart Home,Telecom,etc.

 

Typical Properties of The TIF®100 3030-06 Series
Property Value Test method
Color White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 30 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 5.8MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.

Thermal Conductivity Of 3.0W/Mk Ultra Soft High-Performance Silicone Gap Pads For 5G Aerospace AI AIoT And Automotive 0

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

FACTORY INFORMATION:

 

Factory Size

5,000-10,000 square meters

 

Factory Country/Region

Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

 

Annual Output Value

US$1 Million - US$2.5 Million

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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