Thermal Conductive Pad Silicone Thermal Interface Material For Enhancing Heat Transfer Efficiency In GPU CPU Components

TIF^®100-20-05E Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, effectively transferring heat while providing basic physical protection for a wide range of electronic components.

• Good thermal conductivity
• Moldability for complex parts
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• Available in various thicknesses

• Home appliance industry
• Power module
• Wearable devices
• Solar photovoltaic panels
• LED lighting fixtures
• Routers
• Medical devices
• Audio electronic products
• Unmanned aerial vehicles (UAV)
• Photovoltaic systems
• Signal communication
• New energy vehicles
• Motherboard chip
• Radiator
• AI Processors AI Servers

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

• Our value message is "Do it right the First time, total quality control"
• Our core competency is thermal conductive interface materials
• Competitive advantage products
• Confidentiality agreement and Business Secret Contract
• Free sample offer
• Quality assurance contract