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Thermal Conductive Silicone Thermal Pad 2.0W/mK For Heat Transfer In AI Processors And AI Server Hardware Applications

Thermal Conductive Silicone Thermal Pad 2.0W/mK For Heat Transfer In AI Processors And AI Server Hardware Applications

Thermal Conductive Silicone Thermal Pad 2.0W/mK For Heat Transfer In AI Processors And AI Server Hardware Applications
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Thermal Conductive Silicone Thermal Pad 2.0W/mK For Heat Transfer In AI Processors And AI Server Hardware Applications
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF100-20-05S
Document: TIF100-20-05S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
Contact Now
Detailed Product Description
Products Name: Thermal Conductive Silicone Thermal Pad 2.0W/mK For Heat Transfer In AI Processors And AI Server Hardware Applications Hardness: 65/45shore 00
Keywords: Thermal Conductive Pad Color: Blue
Thermal Conductivity: 2.0W/mK Application: For Heat Transfer In AI Processors And AI Server Hardware Applications
Construction: Ceramic Filled Silicone Elastomer Thickness: 0.010~0.200"(0.25~5.0mm)
Sample: Free

Thermal Conductive Silicone Thermal Pad 2.0W/mK For Heat Transfer In AI Processors And AI Server Hardware Applications
Product Overview

TIF®100-20-05S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Key Features
  • Good thermal conductivity
  • Ultra-soft and highly conformable
  • Self-adhesive without the need for additional surface adhesive
  • Good insulation performance
Applications
  • Home appliance industry
  • Power module
  • Wearable devices
  • Solar photovoltaic panels
  • LED lighting fixtures
  • Routers
  • Medical devices
  • Audio electronic products
  • Unmanned aerial vehicles (UAV)
  • Photovoltaic systems
  • Signal communication
  • New energy vehicles
  • Motherboard chip
  • Radiator
  • AI Processors & AI Servers
Technical Specifications of TIF®100-20-05S Series
Property Value Test Method
Color Blue Visual
Construction Ceramic filled silicone elastomer ******
Density (g/cm³) 2.65 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 (0.25~0.50)
0.030~0.200 (0.75~5.00)		 ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Continuous Use Temp -40 to 200℃ ***
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.7 ASTM D150
Volume Resistivity ＞1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100-20-05S Series Thermal Conductive Silicone Thermal Pad
Company Advantages
  • Our value message is "Do it right the First time, total quality control"
  • Our core competency is thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and Business Secret Contract
  • Free sample offer
  • Quality assurance contract
Frequently Asked Questions
Q: Do you accept custom orders?
A: Yes, we welcome custom orders. Our customization options include dimensions, shape, color, and coating on one or both sides with adhesive or fiberglass. To place a custom order, please provide a drawing or detailed specifications.
Q: How do I request customized samples?
A: To request samples, you can leave us a message on our website, or contact us via email or phone.
Q: What's the thermal conductivity test method given on the data sheet?
A: All data in the sheet are actual tested results. Hot Disk and ASTM D5470 methods are utilized to test thermal conductivity.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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