Thermal Gap Filler Pads Featuring Excellent Elasticity And Low Volatility For Thermal Management In Electronic Devices

Ziitek is a high-tech enterprise dedicated to the research, development, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in this field, we provide the latest, most effective thermal management solutions. Our facility features advanced production equipment, comprehensive testing capabilities, and fully automatic coating production lines for manufacturing high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, and thermal grease. All products comply with UL94 V-0, SGS, and ROHS standards.

The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad specifically designed for thermal management in optical and high-precision electronic devices. This material balances efficient thermal conductivity with extremely low precipitation of condensable volatile substances, effectively preventing contamination of sensitive optical components and precision circuits. The material features excellent flexibility and elasticity, enabling complete filling of micro gaps between heating interfaces and heat dissipation structures, significantly reducing contact thermal resistance, improving thermal conductivity efficiency, and ensuring reliability and extended service life of electronic components during long-term operation.

• Ultra low volatility of siloxane
• Good thermal conductivity
• Excellent weather resistance and aging resistance
• Highly compressible, easy to install and operate
• Good insulation performance

• Motor Controller (MCU)
• Airborne computer
• Machine vision camera
• High performance ASIC chip
• Central control screen