Name: GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF100-15-11UF
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF100-15-11UF
Document:	TIF100-15-11UF_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	AI Server Thermal Pad 2.5W/mK Thermal Management For Servers	Feature:	Good Softness And Filling Property
Hardness:	75 Shore 00	Thickness Range(inch/mm):	0.010"~0.200"(0.25~5.00mm)
Keywords:	GPU Thermal Pad	Thermal Conductive:	1.5W/mK
Application:	Battery Pack Thermal Management
Highlight:	GPU silicone thermal pad , thermal pad for battery pack , heat transfer thermal insulation pad

GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management

Company Profile

Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong. We are a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. With production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam, we ensure efficient delivery and localized services worldwide.

Our product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, serving applications in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields. The company holds IATF16949 and ISO9001 certifications, with products meeting ROHS, REACH and UL specifications.

Product Description

The TIF®100-15-11UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.

Features

Good thermal conductivity
Good softness and filling property
Self-adhesive without the need for additional surface adhesives
Good insulation performance

Applications

Home appliance industry
Power module
Wearable device
Solar photovoltaic panel
LED lighting fixtures
Routers
AI server
Medical equipment
Unmanned aerial vehicle (UAV)
Robot
Wireless Charger

Typical Properties of TIF®100-15-11UF Series

Property	Value	Test Method
Color	Dark Gray	Visual
Construction & Composition	Ceramic filled silicone elastomer	-
Density (g/cm³)	2.1	ASTM D792
Thickness Range (inch/mm)	0.010~0.020 \| 0.030~0.200 0.25~0.50 \| 0.75~5.00	ASTM D374
Hardness (Shore 00)	75	ASTM 2240
Recommended Operating Temperature (℃)	-40 to 200	-
Breakdown Strength (V/mm)	≥5500	ASTM D149
Dielectric Constant @1MHz	4.9	ASTM D150
Volume Resistivity (Ohm*cm)	＞1.0×10¹²	ASTM D257
Flame Rating	V-0	UL 94 (E331100)
Thermal Conductivity	1.5W/m-K	ASTM D5470 ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100-15-11UF Series Thermal Pad product image showing material structure and application

Packaging & Lead Time

Packaging Details:

PET film or foam for protection
Paper card to separate each layer
Export carton inside and outside
Customized packaging available to meet customer requirements

Lead Time: For quantities of 5000 pieces, estimated time to be negotiated.

Frequently Asked Questions

Are you a trading company or manufacturer?

We are a manufacturer with facilities in China and Vietnam.

What Is a Thermal Interface Material (TIM)?

Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.

What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?

Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.

Why Do AI Servers Need High-Performance Thermal Interface Materials?

AI GPUs, CPUs and Application Specific Integrated Circuits generate high power and heat flux, requiring efficient heat transfer to heat sinks or cold plates. High-performance TIMs help reduce interface thermal resistance.

How Do I Choose the Right Thermal Interface Material?

Start with heat source power, gap thickness, target thermal resistance, operating temperature, contact area, assembly pressure, electrical insulation, flame resistance and reliability requirements.

What Thermal Interface Materials Does ZIITEK Offer?

ZIITEK focuses on thermal management materials and solutions for electronics. Our portfolio includes thermal pads, thermal gels and other thermal management materials, with solutions matched to gap, thermal performance, thickness, hardness, electrical insulation and reliability requirements.

For custom specifications, pricing, or technical support, please contact our sales team for personalized assistance.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management

GPU Thermal Pad Offering Excellent Heat Transfer And Electrical Insulation Properties For Battery Pack Thermal Management

GPU silicone thermal pad

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