Thermal Gap Filler Silicone Pad Providing Thermal Conductivity Of 3.0W/mK For 5G, Aerospace And AI

We are a manufacturer with facilities in China and Vietnam.

Generally 3-7 work days for in-stock items, or 7-10 work days for non-stock items, depending on quantity.

Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.

Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.

Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.

Yes. Thermal silicone pads can be used between GPUs, CPUs, memory modules, power modules, and other heat-generating components and their corresponding cooling structures. They are commonly considered for thermal management in high-performance computing systems.

First, measure the actual gap and its tolerance range. Then consider the material's compression characteristics, required assembly pressure, and target thermal resistance when selecting the thickness. Sample testing under actual application conditions is generally recommended to validate the final solution.