Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

4.5W/mK thermal conductivity heat cured epoxy adhesive for bonding two parts of electronics

Product Summary:

TIE™380-45 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength.

TIE™380-45 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

TIE380-45-TDS_EN_REV01.4 (1).pdf

Feature

> Good thermal conductivity: 4.5W/mK

> Good maneuverability andadhesion performance

> Low shrinkage

> Low viscosity, easy-to-gas emissions

> Good solvent resistance, water resistance

> Longer working hours

> Excellent resistance to thermal shock

Application Features:TIE™380-45

Color Gray

Viscosity@25℃ 150,000 cPs

Specific Gravity@25℃ 2.2 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° 4 Hours

125℃ 2 Hour

150℃ 30 Minutes

170℃ 5 Minutes

General package:

1kg/can

Company profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.