Name: High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIE280-12AB
Price: 50.00 USD
Availability: InStock

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High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	RoHS
Model Number:	TIE280-12AB

Payment & Shipping Terms:

Minimum Order Quantity:	10kg
Price:	1-100USD/kg
Packaging Details:	1kg/can
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	10000kg/month

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Detailed Product Description

Material:	Epoxy Glue	Usage:	Bonding Electronics
Appearance Sured:	Dull Gray Solid	Continuous Use Temp:	-40 To 160℃
Thermal Conductivity:	1.2 W/mK	NAME:	Thermal Conductive Glue
Highlight:	Electronic Epoxy Resin Glue , Electronic Thermal Conductive Glue , Electronic Epoxy Resin Adhesive

Thermal Conductive Glue Electronic Epoxy Resin Adhesive

TIE™280--12AB is a two-component, high thermal conductivity, room-temperature curing, long working time and fireproof epoxy resin potting compound, which is especially suitable for potting capacitors and small electronic devices.

Product Summary:

TIE™280-12AB is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIE280-12AB-Series-Datasheet.pdf

Feature

Outstanding thermal performance 1.2W/mK

High tack surface reduces contact resistance

RoHS compliant

UL recognized

Fiberglass reinforced for puncture, shear and tear resistance

Easy release construction

Applications

Heat pipe thermal solutions

Memory Modules

Mass storage devices

Automotive electronics

Set top boxes

Audio and video components

IT infrastructure

GPS navigation and other portable devices

Typical Properties of TIE^TM280-12A
Chemical type	Epoxy	Test Method
Appearance uncured	Black Paste	Visual
Appearance cured	Dull Black Solid	Visual
Components	Two Component	*****
Heat Capacity	0.7 l/g-K	ASTM C351
Key Substrates	Metals, ceramics	*****
Hardness	85 Shore D	ASTM 2240
Continuous Use Temp	-40 to 160℃	*****
Tensile strength Al/Al @25°C	>10,000psi	*****
Thermal Conductivity	1.2 W/m-K	ASTM D5470

Application Features:

TIE™380-12A

Color Black

Viscosity@25℃ 15,000 cPs

Shelf life @25℃° 12Months

TIE™380-12B

Color Black

Viscosity@25℃ 7,000 cPs

Shelf life @25℃° 12Months

TIE™380-12AB(Two Component Mix)

Viscosity(@25℃ )1,000 cPs

Operating time9(@ 25℃)45Minutes

Specific Gravity (@25℃) 1.6 g/cc

Shelf life( @25℃°) 12Months

Curing procedures:

Curing temperature Curing time

25℃° 3 Hours

70℃ 30Minutes

Package:

1KG A/B for each tank. 5KG A/B each. 10KG A/B each.

High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive 0

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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