Name: High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIE™380-25
Price: 50.00 USD
Availability: InStock

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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	RoHS
Model Number:	TIE™380-25

Payment & Shipping Terms:

Minimum Order Quantity:	10kg
Price:	1-100USD/kg
Packaging Details:	1kg/can
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	10000kg/month

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Detailed Product Description

Products Name:	High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound	Material:	Epoxy Glue
Usage:	Bonding Electronics	Appearance Sured:	Dull Gray Solid
Continuous Use Temp:	-40 To 180℃	Thermal Conductivity:	2.5 W/mK
Keywords:	Thermal Epoxy Glue
Highlight:	One Component Thermal Epoxy Glue , Electronic Potting Compound Thermal Epoxy Glue , High Performance Thermal Epoxy Glue

High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound

Product Summary:

TIE^TM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength.

TIE^TM380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

Spec-of-TIE380-25.pdf

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound 0

Feature

> Outstanding thermal performance 2.5W/mK
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction

Applications

> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers

Typical Properties of TIE^TM380-25
Chemical type	Epoxy	Test Method
Appearance uncured	Gray Paste	Visual
Appearance cured	Dull Gray Solid	Visual
Components	One Component	*****
Heat Capacity	0.7 l/g-K	ASTM C351
Key Substrates	Metals, ceramics	*****
Hardness	92 Shore A	ASTM 2240
Continuous Use Temp	-40 to 180℃	*****
Tensile strength Al/Al @25°C	>2800psi	*****
Thermal Conductivity	2.5 W/m-K	ASTM D5470
Packing details	1kg/can	*****

Application Features:TIE™380-25

Color Gray

Viscosity@25℃ 140,000 cPs

Specific Gravity@25℃ 2.1 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° 3 Hours

125℃ 1.5 Hour

150℃ 20 Minutes

170℃ 5 Minutes

Company profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound 1

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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