1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

The TIF120-07E Series hermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

> Electrically isolating
 

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> routers
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> GPS navigation and other portable devices