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high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board

high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board

high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board
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high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF560US Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Contact Now
Detailed Product Description
Thickness: 2.0mmT Specific Gravity: 2.95g/cc
Dielectric Breakdown Voltage: >5500 VAC Thermal Conductivity: 2.6W/m-K
Color: Violet
High Light:

Heatsink Silicone Cooling Pad

,

2.6W Silicone Cooling Pad

,

2.0mm Heatsink Cooling Pad

high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board

 

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 


TIF580US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features
> Good thermal conductive: 2.6W/mK
>  thickness:2.0mmT
Moldability for complex parts
> Broad range of hardnesses available
> High tack surface reduces contact resistance

>Broad range of hardnesses available

>Easy release construction

 

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
Rainproof LED Power
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> GPS navigation and other portable devices

>LED Flesible strip, LED bar

 

 
                                            Typical Properties of TIF580US Series
 
Color
Violet
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.10 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.080"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
45 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 

>10000 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

 

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.3 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20

 

Volume Resistivity
4.2X1013
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
2.6W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

 

 

high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board 0

 

high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board 1

 

 

 

 

 

FAQ

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.

 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

high cost-effective 2.6W/MK CPU Thermal Pad the TIF580US Outstanding thermal performance For mainboard/mother board 2

 

 

TIF500US Datasheet -REV02.pdf

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Sales Manager

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)

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