Name: Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1120-30-11US thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF1120-30-11US thermal pad
Document:	TIF100-30-11US_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm carton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Products Name:	Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues	Hardness:	65/20 Shore00
Keywords:	Thermal Pad	Color:	Gray
Part Number:	TIF1120-30-11US	Material:	Ceramic Filled Silicone Elastomer
Thickness:	3.0mmT	Thermla Conductivity:	3.0W/mK
Application:	Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues
Highlight:	3.0mmT silicone rubber pads , Silicone Rubber Thermally Conductive Pad , 3.0mmT Thermally Conductive Pad

Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues

Company Profile

Ziitek Technology CO.,Ltd is a professional manufacturer of thermal interface materials with 20 years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.

Products description

TIF^®1120-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

>High thermal conductivity
>Super soft and highly compliant
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance

Applications

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>Power tools
>Network communication products
>Electric vehicle batteries
>Computer CPU/GPU Cooling
>New energy vehicle power systems

Key attributes

Typical Properties of TIF^®100-30-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity (W/m-K)	3.0		ASTM D5470
	3.0		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues

Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues

3.0mmT silicone rubber pads

Silicone Rubber Thermally Conductive Pad

3.0mmT Thermally Conductive Pad

Key attributes

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad