Name: Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1200-30-02US
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF1200-30-02US

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	251413cm carton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Prodcuts Name:	Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card	Keyword:	Thermal Gap Pad
Construction & Compostion:	Ceramic Filled Silicone Elastomer	Thickness:	5.0mmT
Hardness:	20/65 Shore 00	Thermal Conductivity:	3.0 W/m-K
Dielectric Constant@1MHz:	7.0 MHz	Application:	Display Card,CPU,GPU
Highlight:	5 mm silicone pad thermal conductivity , display card silicone pad thermal conductivity , 5 mm thermal conductive silicone pad

Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek TIF^®1200-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive:3.0W/mK

> Thickness:5.0mmT

> Hardness:20 Shore 00

> Colour: gray

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant

Applications

> Automotive engine control units

> Telecommunication hardware

> Handheld portable electronics

> Semiconductor automated test equipment (ATE)

> CPU

> display card

Typical Properties of TIF^®100-30-02US Series
Property	Value		Test method
Color	Gray white		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.0)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.0 W/m-K		ASTM D5470
	3.0 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

TheTIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card 1

FAQ

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

Thickness 5mm Thermal Conductivity 3.0 W/Mk CPU GPU Silicone Thermal Pad Thermal Management Materials For Display Card

5 mm silicone pad thermal conductivity

display card silicone pad thermal conductivity

5 mm thermal conductive silicone pad

heat conductive pad,

gap filler pad,

thermal cooling pad