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Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure

Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
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Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1120-10UF thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Feature: Electrically Isolating Dielectric Constant: 3.9 MHz
Dielectric Breakdown Voltage: >5500 VAC Specific Gravity: 2.2 G/cc
Name: -40 To 160℃ Moldability For Complex Parts Conductive Pads For IT Infrastructure Keyword: Thermal Gap Pad
High Light:

ziitek heat sink thermal pad

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3 mm heat sink thermal pad

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heat sink pad for it infrastructure

-40 to 160℃ Moldability for Complex Parts Conductive Pads for IT Infrastructure

 

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

TIF100-10UF-Datasheet-REV02.pdf

 

Ziitek TIF1120-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

<Good thermal conductive:1.5 W/mK
<Thickness: 3.0mmT
<Hardness:75 Shore 00
<Colour: Gray

<RoHS compliant
<UL recognized
<Fiberglass reinforced for puncture, shear and tear resistance

 

 

Applications

<Automotive electronics

<Set top boxes

<Audio and video components

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling

 

 

 
Typical Properties of TIF1120-10UF
 
Product Name TIF1120-10UF Series
Colour gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity 2.2 g/cc
Thickness 3.0mmT
Hardness 75 Shore 00
Dielectric constant@1MHz 3.9 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 1.5 W/mK
Volume Resistivity 1.0*1012 Ohm-cm

 
 

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 

Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure 0
 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure 1
 
FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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