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3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU
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3.0mmT 2.0W/MK Heat Dissipation Pad For CPU
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1120-20-10UF thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Certification: ISO9001 Name: 2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads For CPU
Feature: High Durability Keyword: Thermal Gap Pad
Continuos Use Temp: -40 To 160℃ Thickness: 3.0mmT
High Light:

2.0W/MK Heat Dissipation Pad

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CPU Heat Dissipation Pad

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2.0W/MK Thermal Pad For Heat Sink

2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads for CPU

 

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

TIF100-20-10UF-Datasheet-REV02.pdf

 

Ziitek TIF1120-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


 

<Good thermal conductive: 2.0 W/mK
<Thickness: 3.0mmT
<Hardness:75 Shore 00
<Colour: gray

<Moldability for complex parts
<Soft and compressible for low stress applications
<Naturally tacky needing no further adhesive coating


 
 

 

Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

 

 

 
Typical Properties of TIF1120-20-10UF
 
Product Name TIF1120-20-10UF Series
Colour Gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity 2.7 g/cc
Thickness 3.0mmT
Hardness 75 Shore 00
Dielectric constant@1MHz 4.6 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 2.0W/mK
Volume Resistivity 1.0*1012 Ohm-cm

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU 0
 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU 1
 
FAQ

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A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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