Name: 3.0mmT 2.0W/MK Heat Dissipation Pad For CPU
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1120-20-10UF thermal pad
Price: 4.10 USD
Availability: InStock

Home Products Heat Sink Thermal Pad

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF1120-20-10UF thermal pad

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	252413cm canton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

Contact Now

Detailed Product Description

Certification:	ISO9001	Name:	2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads For CPU
Feature:	High Durability	Keyword:	Thermal Gap Pad
Continuos Use Temp:	-40 To 160℃	Thickness:	3.0mmT
Highlight:	2.0W/MK Heat Dissipation Pad , CPU Heat Dissipation Pad , 2.0W/MK Thermal Pad For Heat Sink

2.0W/mK Naturally Tacky Needing No Further Adhesive Coating Conductive Pads for CPU

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

TIF100-20-10UF-Datasheet-REV02.pdf

Ziitek TIF1120-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

<Good thermal conductive: 2.0 W/mK

<Thickness: 3.0mmT

<Hardness:75 Shore 00

<Colour: gray

<Moldability for complex parts
<Soft and compressible for low stress applications
<Naturally tacky needing no further adhesive coating

Applications

<Automotive engine control units

<Telecommunication hardware

<Handheld portable electronics

<Semiconductor automated test equipment (ATE)

<CPU

<display card

Typical Properties of TIF1120-20-10UF
Product Name	TIF1120-20-10UF Series
Colour	Gray
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	2.7 g/cc
Thickness	3.0mmT
Hardness	75 Shore 00
Dielectric constant@1MHz	4.6 MHz
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	2.0W/mK
Volume Resistivity	1.0*10^12 _Ohm-cm

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU 1

FAQ

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Tag:

thermal interface material pad,

thermal heat transfer pads,

thermal laptop cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer

product name: Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer

Materials: Ceramic filled silicone elastomer / Fiberglass

Feature: Soft and Compressible for low stress applications

Thermal conductivity: 3.0 W/mK

Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Product name: Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad

Materials: Ceramic filled silicone elastomer

Feature: Ultra soft

Thermal conductivity: 3.0W/mK

3.0W Thermal Gap Filler Insulation Sheet for LED CPU GPU MOS with Flam Rating 94 V-0 from Customized

Products name: 3.0W High Quality Factory Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

Thinkness range: 0.020"(0.50mm)~0.200"(5.00mm)

Keywords: Silicone Thermal Pad

Hardness: 27±5 Shore 00

High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

Products name: High Performance 6.5W Heatsink Thermal Pads GPU CPU Cooling Conductive Silicone Thermal Pad

Thinkness range: 0.020"(0.50mm)~0.200"(5.00mm)

Keywords: Silicone Thermal Pad

Hardness: 20 Shore 00

8W/MK Silicon Thermal Pad Gap Filling Soft and Compressible for Low Stress in -45 To 200 C Environment

Products name: 8W/MK Silicon Thermal Pad Gap Filling

keyword: Thermal Pad

Hardness(thickness≥1.0mm）: 45±5 Shore 00

Hardness(thickness＜1.0mm）: 55±5 Shore 00

Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card

Product name: Custom 3.0W Ultra-Soft High Thermal Conductive Silicon Pad For Graphics card

Materials: Ceramic filled silicone elastomer / Fiberglass

Application: Electric Parts Heat Transfer

Samples: Free Samples

Silicone Rubber High Conductive Thermal Pad Cooling Gap Filler Insulation For CPU

Name: Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad for CPU

Keyword: Thermal pads

Specific gravity: 3.55g/cm³

Hardness: 60±10

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

3.0mmT 2.0W/MK Heat Dissipation Pad For CPU

2.0W/MK Heat Dissipation Pad

CPU Heat Dissipation Pad

2.0W/MK Thermal Pad For Heat Sink

thermal interface material pad,

thermal heat transfer pads,

thermal laptop cooling pad