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4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules

4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules

  • 4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules
  • 4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules
4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1180N-40-10F thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Thickness: 4.5mmT Part Number: TIF1180N-40-10F
Keyword: Thermal Gap Pad Dielectric Breakdown Voltage: >5500 VAC
Name: 4.0 W/mK Moldability For Complex Parts Thermal Pad For RDRAM Memory Modules Application: Telecommunication Hardware
High Light:

4.0 W/MK heat sink thermal pad

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4.5mm heat sink thermal pad

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RDRAM Memory Modules heat sink pad

4.0 W/mK Moldability for Complex Parts Thermal Pad for RDRAM Memory Modules

 

Company Profile

With professional R&D capabilities and over 17 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

TIF100N-40-10F-Specification-sheet.pdf

 

Ziitek TIF1180N-40-10F​ thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.


 

<Good thermal conductive: 4.0 W/mK
<Thickness: 4.5mmT
<Hardness:55±5 Shore 00
<Colour: gray

<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications

 

 

 

Applications

<cooling components to the chassis of frame

<High speed mass storage drives

<Heat Sinking Housing at LED-lit BLU in LCD

<LED TV and LED-lit lamps

<RDRAM memory modules

<Micro heat pipe thermal solutions

 

 
Typical Properties of TIF1180N-40-10F
 
Product Name TIF1180N-40-10F Series
Colour Gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity

2.1 g/cm^3

Thickness 4.5mmT
Hardness 55±5 Shore 00
Dielectric constant@1MHz 4.7 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 4.0W/mK
Volume Resistivity 1.0*1012 Ohm-cm

 
 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

 

4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules 0
 

 
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules 1
 
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Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

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