Name: Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF7100PUS thermal pad
Price: 4.10 USD
Availability: InStock

Home Products Heat Sink Thermal Pad

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF7100PUS thermal pad

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	252413cm canton
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Name:	Wholesale Customized High Temperature Thermal Conductive Silicone Insulation Pad For Display Card GPU Laptop	Specific Gravity:	3.2 G/cm³
Hardness:	20	Thickness:	2.5 MmT
Part Number:	TIF7100PUS	Keyword:	Thermal Interface Pad
Highlight:	Low thermal impedance thermal interface pad , GPU CPU heatsink thermal interface pad

Wholesale Customized High Temperature Thermal Conductive Silicone Insulation Pad For Display card GPU Laptop

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF700PUS-data sheet.pdf

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling Thermal Interface Pad 0

Ziitek TIF7100PUS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

< Good thermal conductive: 7.5W/mK

< Thickness: 2.5mmT

< Hardness: 20

< Colour: gray

< Good thermal conductive
< Moldability for complex parts
< Soft and compressible for low stress applications

Applications

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF7100PUS
Product Name	TIF7100PUS Series
Colour	Gray
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	3.2 g/cc
Thickness	2.5mmT
Hardness(Shore 00)	20
Dielectric constant@1MHz	4.5 MHz
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>6000 VAC
Thermal conductivity	7.5W/mK
Flame Rating	94-V0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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