8.5W/mK Thermal Interface Material Phase Change Thermal Pad For Power Electronics

The TIC^®800R Series is an ultra-high thermal conductivity phase change material featuring a unique grain orientation structure. Through a micro-ordered arrangement, this structure achieves directional optimization of the heat flow path, significantly doubling macroscopic thermal conductivity efficiency. When the temperature exceeds the phase transition point of 50°C, the material softens and infiltrates the interface, filling micro-irregular gaps and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface, thereby improving the efficiency of the heat dissipation system.

• Excellent thermal conductivity
• Good process compatibility
• Soft surface and self-adhesive
• Low thermal resistance

• Power conversion equipment
• Payload processor
• Server CPU
• GPU cooling

• Standard Thickness: 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm)
• Standard Size: 15.748" × 6.299" (400 mm × 160 mm)

TIC^® series can be molded into different shapes to provide. If you need different thicknesses or would like to learn more about thermal conductive materials, please contact our company.

Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste, thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel, silicone foam, silicone-free thermal pads, and more.

We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.

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