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Low-Melting Thermal Interface Material Phase Change Sheet For Power Conversion Equipment

Low-Melting Thermal Interface Material Phase Change Sheet For Power Conversion Equipment

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIC800H
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-6 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Name: Low-Melting Thermal Interface Material Phase Change Sheet For Power Conversion Equipment Applicatoin: Power Conversion Equipment
Recommended Operating Temp(℃): -40~125℃ Color: Gray
Keyword: Phase Change Materials Feature: Low Steady-state Thermal Resistance
Phase Change Softening Temperature: 50~60℃ Thermal Conductivity: 7.5W/mK
Highlight:

Low-Melting Thermal Interface Material

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Power Conversion Equipment Thermal Interface Material

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Thermal Interface Material Phase Change Sheet

Low-Melting Thermal Interface Material Phase Change Sheet For Power Conversion Equipment

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

TIC®800H Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. This structure achieves directional optimization of the heat flow path through micro ordered arangement, significantly doubling the macroscopic thermal conductivity efficiency.When the temperature exceeds the phase transition point of 50 C, the material can soften and infiltrate theinterface, filling micro irregular gaps, and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface, improving the efficiency of the heat dissipation system.

Features

 

> Excellent thermal conductivity
> Good process compatibility
> Soft surface and self adhesive
> Low steady-state thermal resistance

Applications

> Power conversion equipment
> Payload processor
> Server CPU
> Game graphics card GPU chip heat dissipation

 

Typical Properties of TIC®800H Series
Product Name TIC®808H TIC®810H TIC®812H Test Method
Color Gray Visual
Thickness 0.008" 0.010" 0.012" ASTM D374
(0.20mm) (0.25mm) (0.30mm)
Density 2.7g/cc ASTM D792
Recommended Operating Temperature (℃) -40℃~125℃ *****
Phase Change Softening Temperature(℃) 50℃~60℃ *****
Thermal Conductivity 7.5 W/mK ASTM D5470
Thermal Impedance(℃-cm²/W) @10 psi 0.018 0.019 0.021 ASTM D5470
Thermal Impedance(℃-cm²/W) @50 psi 0.013 0.014 0.015 ASTM D5470

 

Standard Thickness: 0.008(0.20 mm), 0.010(0.25 mm),0.012"(0.30 mm).

Standard Size: 10"x 16"(254 mm x 406 mm).

TIC®series can be molded into different shapes to provide. If you need different thicknesses or would like to learn more about thermal conductive materials, please contact our company.

 

Low-Melting Thermal Interface Material Phase Change Sheet For Power Conversion Equipment 0

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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