Name: 2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF520BS
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF520BS

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module	Application:	Graphics Card Thermal Module
Thickness:	0.020"(0.5mm)	Specific Gravity:	3.0g/cc
Dielectric Breakdown Voltage:	>5500 VAC	Thermal Conductivity:	2.6W/m-K
Color:	Blue	Operating Temp:	-45~200℃
Keywords:	Thermal Pad

2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Product introduction

TIF^TM520BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features
> Good thermal conductive: 2.6W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance

Applications
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF^TM520BS Series
Property	Value	Test method
Color	Blue	Visual
Construction &Compostion	Ceramic filled silicone elastomer	***
Thickness range	0.020"(0.5mm)	ASTM D374
Hardness	13 Shore 00	ASTM 2240
Specific Gravity	3.0 g/cc	ASTM D792
Continuos Use Temp	-45 to 200℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	5.0 MHz	ASTM D150
Volume Resistivity	2.0X10¹³Ohm-meter	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	2.6W/m-K	ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

2.6W/M.K Cooling Gap Filler Insulation Silicone Sheet High Conductive Thermal Pad For Graphics Card Thermal Module 0

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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