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Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle

Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF100-07S Series
Document: TIF100-07S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle Sample: Sample Free
Dielectric Constant: 4.5MHz Breakdown Voltage(V/mm): ≥5500
Keywords: Thermal Gap Filler Pad Thermal Conductivity: 1.5W/m-K
Thickness Range: 0.020"~0.200"(0.5mm~5.0mm) Color: Green
Fire Rating: 94 V0 Application: Signal Communication & New Energy Vehicle
Highlight:

thermal pad for new energy vehicles

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1.5W thermal gap filler pad

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0.5mm-5.0mm heat sink pad

Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle
Signal Communication Thermal Pad 1.5W 0.5mm~5.0mm Thickness Thermal Gap Filler Pad For New Energy Vehicle
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for competitive markets. Our extensive experience allows us to best assist customers in thermal engineering. We serve customers with customized products, full product lines, and flexible production, making us your reliable partner. Let's make your design more perfect!
Ziitek TIF®100-07S Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation fins or metal bases. Their flexibility and elasticity make them ideal for coating uneven surfaces. Heat can efficiently transfer from heating elements or entire PCBs to metal housings or dissipation plates, effectively enhancing the efficiency and lifespan of heat-generating electronic components.
Features
  • Good thermal conductivity: 1.5W/mK
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Outstanding thermal performance
  • Easy release construction
  • Electrically isolating
  • High durability
Applications
  • Cooling components to the chassis of frame
  • High speed mass storage drives
  • Routers
  • Medical Devices
  • Auditioning electronic products
  • Unmanned aerial vehicle (UAV)
  • Photovoltaic
  • Signal communication
  • New energy vehicle
  • Motherboard chip
  • Radiator
  • Display card
  • Mainboard/mother board
  • Notebook
  • Power supply
  • Heat pipe thermal solutions
Typical Properties of TIF®100-07S Series
Property Value Test Method
Color Green Visual
Construction & Composition Ceramic filled silicone elastomer -
Density (g/cm³) 2.2 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0
ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ -
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.5 W/m-K ASTM D5470
ISO22007
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Additional Product Specifications
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16" (203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirmation.
Signal Communication Thermal Pad product image
Packaging Details & Lead Time
Packaging of Thermal Pad:
  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Meet with customers' requirements - customized
Lead Time:
Quantity (Pieces): 5000
Estimated Time (days): To be negotiated
Why Choose Us?
  • Our value message is "Do it right the First time, total quality control"
  • Our core competencies are thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement Business Secret Contract
  • Free sample offer
  • Quality assurance contract
FAQ
Q: Are you a trading company or manufacturer?
A: We are a manufacturer in China.
Q: How to find the right thermal conductivity for my applications?
A: It depends on the watts of power source and ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend the most suitable thermal conductive materials.
Q: Do you accept custom orders?
A: Yes, welcome to custom orders. Our custom elements include dimension, shape, color, and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order, please kindly provide a drawing or leave your custom order information.
Q: How much are the pads?
A: Price depends on your size, thickness, quantity, and other requirements such as adhesive and others. Please let us know these factors first so that we can give you an exact price.
Signal Communication Thermal Pad additional product image

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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